发明名称 DEVICE FOR PROCESSING UNDER VACUUM
摘要 PROBLEM TO BE SOLVED: To provide a sputtering device in which an ultimate vacuum is improved. SOLUTION: In the sputtering device, a space surrounded with an O-ring 51, a target 60 and a vacuum tank 2 is made a vacuum atmosphere, and an insulating member 4 is arranged at the outside of the space. The insulating member 4 is not exposed directly to the space surrounded with the O-ring 51, the target 60 and the vacuum tank 2, that is, the inside of the vacuum tank 2. Therefore, release of gases from the insulating member 4 to the inside of the vacuum tank 2 is avoided and the amount of gases discharged into the inside of the vacuum tank 2 is made small even when the insulating member 4 releasing relatively large amount of gases is used. Accordingly, the ultimate vacuum can be improved.
申请公布号 JP2003038949(A) 申请公布日期 2003.02.12
申请号 JP20010229666 申请日期 2001.07.30
申请人 ULVAC JAPAN LTD 发明人 MORIMOTO NAOKI;KONDO TOMOYASU;NABEYA AKIO;NAKAJIMA KUNIAKI
分类号 B65D81/20;B01J3/03;B65D53/02;C23C14/56;(IPC1-7):B01J3/03 主分类号 B65D81/20
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