发明名称 COPPER-CLAD LAMINATE
摘要 <p>To reduce warping of a copper clad laminate coated with copper foils of different thicknesses on both sides, and thereby to improve production efficiency of the printed-wiring boards, there is provided a copper clad laminate coated with copper foils of different thicknesses on both sides, wherein a first copper foil on one side of the laminate is not recrystallizable by hot pressing for production of said laminate and a second foil on the other side is recrystallizable by the hot pressing and thicker than the first foil.</p>
申请公布号 EP1264683(A4) 申请公布日期 2003.02.12
申请号 EP20010958387 申请日期 2001.08.22
申请人 MITSUI MINING & SMELTING CO., LTD. 发明人 YAMAMOTO, TAKUYA;NAGATANI, SEIJI;NAKANO, MASAHIKO
分类号 B32B15/08;B32B15/20;H05K1/02;H05K1/09;H05K3/00;H05K3/02;(IPC1-7):B32B15/08 主分类号 B32B15/08
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