发明名称 |
COPPER-CLAD LAMINATE |
摘要 |
<p>To reduce warping of a copper clad laminate coated with copper foils of different thicknesses on both sides, and thereby to improve production efficiency of the printed-wiring boards, there is provided a copper clad laminate coated with copper foils of different thicknesses on both sides, wherein a first copper foil on one side of the laminate is not recrystallizable by hot pressing for production of said laminate and a second foil on the other side is recrystallizable by the hot pressing and thicker than the first foil.</p> |
申请公布号 |
EP1264683(A4) |
申请公布日期 |
2003.02.12 |
申请号 |
EP20010958387 |
申请日期 |
2001.08.22 |
申请人 |
MITSUI MINING & SMELTING CO., LTD. |
发明人 |
YAMAMOTO, TAKUYA;NAGATANI, SEIJI;NAKANO, MASAHIKO |
分类号 |
B32B15/08;B32B15/20;H05K1/02;H05K1/09;H05K3/00;H05K3/02;(IPC1-7):B32B15/08 |
主分类号 |
B32B15/08 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|