APPARATUS FOR GROUNDING HEATING CHAMBER OF SPUTTERING DEPOSITION SYSTEM

摘要

PURPOSE: An apparatus for a grounding heating chamber of sputtering deposition system is provided to prevent damage of substrate patterns due to contact electrification by draining electric charges in the substrate through the ground device. CONSTITUTION: The heating chamber(101) includes a plurality of stacked heating plate(102). Each heating plate(102) has a heating coil(103) for heating substrates. A hook pin(104) and a lift pin(105) are provided at four inner corners of the chamber for laying entering substrates or lifting leaving substrates by operation of an actuator(106). A ground plate(110) is mounted along the top side of the hook pin(104) with the rear end thereof electrically connected to the lower end of the lift pin(105). The top portion of the lift pin(105) exposed to the chamber is connected to the chamber body by way of a ground line(111).