发明名称 |
CLAMP AND SEMICONDUCTOR FABRICATION APPARATUS HAVING THE SAME |
摘要 |
PURPOSE: A clamp and a semiconductor fabrication apparatus having the same are provided to fix a wafer to a pedestal without concentrating a pressure on a flat zone of a wafer. CONSTITUTION: A clamp(200) has a shape of ring. The clamp(200) is contacted with an edge of a wafer(W2) since the clamp(200) has an inside diameter(D2) smaller than a diameter(D1) of the wafer(W2). The clamp(200) has a groove(H1) which is formed on a predetermined position corresponding to a flat zone(F2) of the wafer(W2) in order to minimize the area of a contact portion between the clamp(200) and the flat zone(F2) of the wafer(W2). The groove(H1) can be formed to expose the flat zone(F2). The pressure applied to the flat zone(F2) can be reduced since the clamp has the groove(H1).
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申请公布号 |
KR20030012485(A) |
申请公布日期 |
2003.02.12 |
申请号 |
KR20010046518 |
申请日期 |
2001.08.01 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KO, EUN HO;LEE, DO JIK |
分类号 |
H01L21/68;(IPC1-7):H01L21/68 |
主分类号 |
H01L21/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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