| 摘要 |
A modular computer system, for example a high density server system, includes an enclosure for receiving a number of computer system modules. A number of information processing modules 43, for example server blades, are receivable at a first face of the enclosure. A number of support modules 71 of a first type, for example combined switch and service processor modules, and a number of support modules 81 of a second type, for example power supply modules, are receivable at the second face of the enclosure. In order to provide cooling air to the first type of support modules, which are temperature sensitive, a plenum chamber 66 provides a flow path 77 for cooling air that bypasses the information processing modules. For the second type of support module, which is not as temperature sensitive, a flow path 78 for cooling air is provided that passes through the information processing modules. The specification also describes a power supply module with a sloping apertured portion of its top face which defines a plenum space. It also describes a movable barrier for blocking air flow through a location for a power supply module when it is removed.
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