发明名称 |
Enhanced underfill adhesion of flip chips |
摘要 |
A flip chip having a chip passivation layer disposed on a metalization layer. Terminal vias are formed in the passivation layer exposing a portion of the metalization layer and terminal metalization is disposed on the metalization layer at the terminal vias. A stress reducing layer is disposed on the chip passivation layer with underfill apertures formed in the stress reducing layer so as to expose selected portions of the chip passivation layer, thereby enhancing the adhesion of an underfill material to the flip chip. <IMAGE> |
申请公布号 |
EP0890981(B1) |
申请公布日期 |
2003.02.12 |
申请号 |
EP19980112022 |
申请日期 |
1998.06.30 |
申请人 |
ROBERT BOSCH GMBH;UNIVERSAL INSTRUMENTS CORPORATION |
发明人 |
WESTBY, GEORGE RUSSEL;BORGESEN, PETER;PRINZ VON HESSEN, WILHELM |
分类号 |
H01L21/60;H01L21/56;(IPC1-7):H01L21/56 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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