| 摘要 |
PURPOSE: A semiconductor wafer ashing apparatus and its method are provided to rapidly remove hardened photoresist on a high dose implanted wafer without popping of the photoresist by using a halogen lamp array. CONSTITUTION: An ashing apparatus includes a process chamber(1), a lamp heating part(10) disposed at the top portion of the chamber, a heating chuck(3) for heating wafers, and a lift pin(2) for ascending or descending wafers. The lift pin(2) is disposed at the upper portion of the heating chuck(3) and supports wafers with more than three pins. The lift pin(2) is adapted to move up and down so that the distance between the wafer and the heating chuck(3) may be adjusted in two ranges. The lamp heating part(10) includes an U-shaped halogen lamp array(11), a heat reflector(12), and a circular lamp housing for supporting the lamp and reflector.
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