发明名称 Method and apparatus for thermal assembling of connecting areas of two substrates
摘要 Between the two coupling faces (18,20) of opposite substrates (17,18) are formed contact pairs (37), with each pair separately irradiated by laser energy. The laser radiation from a laser emitter (11) is deflected as a beam path (28), via a first swivel mirror unit (29) to a second one (30) and from the latter onto a contact pair. The substrate coupling faces are pressed together by a compression unit (14), between whose force initiator and a rear side (26) of the substrate (18) is provided a transparent, incompressible and deformable vol.
申请公布号 EP1283085(A1) 申请公布日期 2003.02.12
申请号 EP20020023748 申请日期 1998.11.20
申请人 PAC TECH - PACKAGING TECHNOLOGIES GMBH 发明人 MOMENI, KAVEH, DR.-ING.
分类号 B23K1/00;B23K1/005;H01L21/60;H05K3/34;H05K3/36 主分类号 B23K1/00
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