APPARATUS FOR HEATING WAFER AND APPARATUS FOR BAKING PHOTORESIST FILM ON WAFER

摘要

PURPOSE: An apparatus for heating a wafer and an apparatus for baking a photoresist film on a wafer are provided to form a photoresist pattern having uniform size on the wafer by reducing heat shock applied to the photoresist film. CONSTITUTION: A solid-state heat transfer medium(10) and a heat source(20) are used for supporting a wafer(100). A fluid heat transfer medium(30) is arranged between the solid-state heat transfer medium(10) and the heat source(20). The fluid heat transfer medium(30) is heated or cooled by using the heat source(20). The fluid heat transfer medium(30) is changed to a state of vapor or a state of liquid by heating or cooling the fluid heat transfer medium(30). The fluid heat transfer medium(30) is shifted to the solid state heat transfer medium(10) by absorbing the heat from the heat source(20). The fluid heat transfer medium(30) transfers the heat to the solid state heat transfer medium(10) when the fluid heat transfer medium(30) comes in contact with the solid state heat transfer medium(10).