| 摘要 |
An encapsulated device comprises a solid state device, a first encapsulating material and a second encapsulating material having a higher thermal conductivity than the first encapsulating material. The solid state device may be an LED. The first encapsulating material located above the LED may be transparent to LED light or radiation, while the second encapsulating material located below the LED may have a high thermal conductivity to decrease the LED operating temperature.
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