Circuit board reducing a warp and a method of mounting an integrated circuit chip

摘要

A circuit board includes a wiring board 2 and plural integrated circuit chips (LSI 1) mounted on the wiring board. At least one of the integrated circuit chips is mounted on a first surface of the wiring board 2 as a flip chip and the part mounted as a flip chip is sealed with resin. Further, a bare plate (a flat plate 5) is mounted on a second surface of the wiring board 2 with a resin (sealing resin 3) opposite the first surface where the integrated circuit chip mounted as a flip chip.