发明名称 |
Method of controlling wafer polishing time using sample-skip algorithm and wafer polishing using the same |
摘要 |
A method of controlling a wafer polishing time using a sample-skip algorithm and a method of polishing a wafer using the same are provided. According to the method of controlling a wafer polishing time, a chemical mechanical polishing (CMP) process is performed on a plurality of wafers of an n-th lot among a plurality of lots, each lot consisting of a plurality of wafers, for a time DELTAt(n), to calculate the amount removed DELTAToxP(n) from a polished layer on the wafer. The removal rate RRb(n) of a layer on a blanket wafer is calculated from the amount removed DELTAToxP(n). A CMP time DELTAt(n+1) is determined for wafers of an n+1-th lot using the relationship equation DELTAt(n+1)={DELTAToxT(n+1)+A}/RRb(n) where "A" is a constant and DELTAToxT(n+1) is the target amount of a layer to be removed from a wafer of an n+1-th lot.
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申请公布号 |
US6517412(B2) |
申请公布日期 |
2003.02.11 |
申请号 |
US20010951506 |
申请日期 |
2001.09.14 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE JAE-DONG;YOON BO-UN;YANG KYOUNG-MO;HAH SANG-ROK |
分类号 |
H01L21/304;B24B49/02;H01L21/302;(IPC1-7):B24B49/00;B24B51/00;B24B1/00 |
主分类号 |
H01L21/304 |
代理机构 |
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主权项 |
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地址 |
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