发明名称 |
Printed wiring board, and method and apparatus for manufacturing the same |
摘要 |
In manufacturing a double-layered or a multi-layered printed wiring board, a layer of metamorphic substance, which is created by transmuting a substrate material, is formed on an inner wall of a hole during a perforation process of the substrate utilizing radiation energy. The layer of metamorphic substance prevents conductive materials constituting electrical connection formed on the inner wall of the hole from dispersing over a surface of the substrate or permeating into the substrate.
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申请公布号 |
US6518515(B2) |
申请公布日期 |
2003.02.11 |
申请号 |
US20010976376 |
申请日期 |
2001.10.12 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO, LTD. |
发明人 |
NISHII TOSHIHIRO;YAMANE SHIGERU;NAKAMURA SHINJI;HAYASHI HIDENORI;FUJIMOTO TORU;OKADA TOSHIHARU;NAKAI IZURU |
分类号 |
H05K1/03;H05K3/00;H05K3/40;(IPC1-7):H01R9/09 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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