发明名称 Printed wiring board, and method and apparatus for manufacturing the same
摘要 In manufacturing a double-layered or a multi-layered printed wiring board, a layer of metamorphic substance, which is created by transmuting a substrate material, is formed on an inner wall of a hole during a perforation process of the substrate utilizing radiation energy. The layer of metamorphic substance prevents conductive materials constituting electrical connection formed on the inner wall of the hole from dispersing over a surface of the substrate or permeating into the substrate.
申请公布号 US6518515(B2) 申请公布日期 2003.02.11
申请号 US20010976376 申请日期 2001.10.12
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO, LTD. 发明人 NISHII TOSHIHIRO;YAMANE SHIGERU;NAKAMURA SHINJI;HAYASHI HIDENORI;FUJIMOTO TORU;OKADA TOSHIHARU;NAKAI IZURU
分类号 H05K1/03;H05K3/00;H05K3/40;(IPC1-7):H01R9/09 主分类号 H05K1/03
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