| 摘要 |
A novel thermal bus is shown that more effectively transmits heat away from a die of an IC. The innovative thermal bus is capable of transmitting heat to other heat dissipating devices such as heat sinks, which eventually transmit the heat out to ambient. One aspect of the thermal bus leading to increased performance includes an added path for conducting heat in addition to the path through the backside of the die. Another aspect of the thermal bus leading to increased performance includes coupling the thermal bus to the active side of the die to more directly transmit heat from the electronic devices that are generating the heat. Local hot spots are therefore minimized, and the overall average temperature of the die is reduced, which allows improved performance of the microelectronic chip, such as operating at a higher frequency for a given upper threshold temperature.
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