发明名称 |
Through-the-substrate investigation of flip-chip IC's |
摘要 |
Methods are provided for exposing a selected feature of an IC device, such as a selected conductor, from the back side of the substrate without disturbing adjacent features of the device, such as active regions. One such method comprises: (a) determining a region of the IC device in which the selected feature is located; (b) acquiring from the back side of the substrate an IR optical microscope image of the region; (c) aligning the IR optical microscope image with a coordinate system of a milling system; and (d) using structures visible in the IR optical microscope image as a guide, operating the milling system to expose the selected feature from the back side of the IC device without disturbing adjacent features.
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申请公布号 |
US6518571(B2) |
申请公布日期 |
2003.02.11 |
申请号 |
US20010781488 |
申请日期 |
2001.02.10 |
申请人 |
SCHLUMBERGER TECHNOLOGIES, INC. |
发明人 |
TALBOT CHRISTOPHER GRAHAM;BROWN JAMES HENRY |
分类号 |
G01Q30/04;G01Q10/06;G01Q20/02;H01L21/02;H01L21/66;(IPC1-7):H01J37/30 |
主分类号 |
G01Q30/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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