发明名称 |
Solvent for dissolving cured adhesive |
摘要 |
A new solvent formulation is invented for removing cured adhesive and coating. It solves the problem that crosslink polymers only can be swelled, and a mechanical force has to be applied to remove the adhesive. The new solvent can dissolve the UV cured crosslink polymers very fast and clean the substrate meanwhile.
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申请公布号 |
US6518230(B2) |
申请公布日期 |
2003.02.11 |
申请号 |
US20010811126 |
申请日期 |
2001.03.16 |
申请人 |
SAE MAGNETICS (H.K.) LTD. |
发明人 |
WU QUANSHENG;FU YU;TIAN ZHANQIU |
分类号 |
C09D9/04;C11D3/43;C11D7/26;C11D7/50;(IPC1-7):C11D3/18 |
主分类号 |
C09D9/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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