CHEMICALLY AMPLIFIED NEGATIVE PHOTORESIST COMPOSITION FOR THICK FILM, PHOTORESIST SUBSTRATE, AND BUMP FORMING METHOD USING THE COMPOSITION

摘要

PURPOSE: A chemically amplified negative photoresist composition for a thick film, a photoresist substrate and a bump forming method using the composition are provided, to improve the sensitivity and the plating resistance. CONSTITUTION: The chemically amplified negative photoresist composition comprises an alkali-soluble resin; a compound generating an acid by the irradiation of a radiant ray; and a compound capable of being crosslinked in the presence of an acid, wherein the alkali-soluble resin is a mixture comprising 50-98 wt% of a novolac resin having a mass average molecular weight of 5,000-10,000 and 2-50 wt% of a polymer having at least hydroxystyrene unit and a mass average molecular weight of 5,000 or less. Preferably the alkali-soluble resin comprises m-cresol novolac resins obtained by condensation of m-cresol and aldehydes in the presence of an acid catalyst; and the compound generating an acid by the irradiation of a radiant ray is a compound having at least two oxime sulfonate groups represented by R-SO2O-N=C(CN)-, wherein R is an alkyl or aryl group.