| 发明名称 |
Apparatus and method for reducing interposer compression during molding process |
| 摘要 |
A method for inhibiting damage caused to semiconductor die packages during a molding process, and the semiconductor die packages formed therefrom, is described. One or more openings are provided in a die carrier which are filled with a material which is more resistant to compressive forces than the carrier. |
| 申请公布号 |
US6518678(B2) |
申请公布日期 |
2003.02.11 |
| 申请号 |
US20000749872 |
申请日期 |
2000.12.29 |
| 申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
JAMES STEPHEN L.;RUMSEY BRAD D. |
| 分类号 |
H01L21/56;H01L23/00;H01L23/13;(IPC1-7):H01L23/28;H01L23/02 |
主分类号 |
H01L21/56 |
| 代理机构 |
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| 主权项 |
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| 地址 |
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