| 摘要 |
PURPOSE: A wafer processing member is provided to prevent from being deformed due to thermal expansion even in the case where the wafer processing member is used in heating treatment. CONSTITUTION: A wafer processing member(1) has a base material(2), a recess(3) formed on one surface of the base material(2), a recess(4) formed on the other surface of the base material(2), and a ceramic film(5) with which the base material(2) is coated. The base material is constituted by a base material which is isotropic in all in-plane directions. The base material is isotropic in the coefficient of thermal expansion in all in-plane directions.
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