发明名称 |
Electronic part and method of assembling the same |
摘要 |
An electronic part in which a surface acoustic wave device or the like is packaged by using a resin. The electronic part has a resin base in which a lead frame and a resin are integrally molded, a surface acoustic wave device or the like mounted on the top face of the resin base, a bonding wire for connecting a lead portion on the top face of the resin base and the electronic device, and a resin cap which is bonded on the resin base so as to form a space between the resin cap and the resin base. Apart of the lead is bent along the surface of the plastic package. It is also possible to dispose the surface acoustic wave device so that its electrode pattern formation surface faces the resin base without using the bonding wire.
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申请公布号 |
US6518501(B1) |
申请公布日期 |
2003.02.11 |
申请号 |
US20000696580 |
申请日期 |
2000.10.25 |
申请人 |
NRS TECHNOLOGIES INC. |
发明人 |
KAWAHARA HIROSHI;SAKAI MINORU;YAMAMOTO YASUSHI |
分类号 |
H01L41/09;H01L23/043;H01L23/055;H01L23/057;H01L23/08;H01L23/498;H03H3/02;H03H3/08;H03H9/10;H03H9/25;(IPC1-7):H01L23/02 |
主分类号 |
H01L41/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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