| 摘要 |
A method for fabricating a NROM is described, in which a bottom anti-reflective coating (BARC) and a photoresist pattern are sequentially formed on a substrate that has a charge trapping layer formed thereon. An etching process is then performed to pattern the BARC and the charge trapping layer with the photoresist pattern as a mask. The etching process is conducted in an etching chamber equipped with a source power supply and a bias power supply, which two have a power ratio of 1.5~3, while an etchant used therein is a gas plasma containing trifluoromethane (CHF3) and tetrafluoromethane (CF4). Thereafter, a buried drain is formed in the substrate, a buried drain oxide layer is formed on the buried drain, and then plural gates are formed on the substrate.
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