Bump-attached wiring circuit board and method for manufacturing same

摘要

A bump formation etching mask is formed on the bump formation side of a metal foil having a thickness (t1+t2) equal to the sum of the thickness t1 of a wiring circuit and the height t2 of the bumps to be formed on a wiring circuit. The bumps are formed by half-etching the metal foil from the bump formation etching mask side down to a depth corresponding to a predetermined bump height t2. A metal thin film layer formed of a different metal from the metal foil is formed on the bump formation side of the metal foil, thereby providing a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations, such as plating pretreatments.