发明名称 System and method for mounting a stack-up structure
摘要 Disclosed are systems and methods which utilize mounting members adapted to provide consistent compressive pressure with respect to strata of a laminated structure, such as the heat source, TEC, and heat absorbing layers of a TEC stack-up, throughout a range of operating temperatures. Preferably, mounting members of the present invention are adapted to provide uniform compressive pressure across a surface area, such as the heat transferring surfaces of a TEC, to thereby provide a sound structure which is relatively resistant to dynamic forces. Preferred embodiment mounting members are adapted to minimize the transfer of thermal energy therethrough, such as to substantially avoid a heat leak in a TEC stack-up configuration.
申请公布号 US6519157(B1) 申请公布日期 2003.02.11
申请号 US20010004253 申请日期 2001.10.23
申请人 NLIGHT PHOTONICS CORPORATION 发明人 XING ANDREW
分类号 H01L35/00;H01S5/024;(IPC1-7):H05K7/20 主分类号 H01L35/00
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