发明名称 |
Reduced thickness optical image pickup device with improved sealing and method of making same |
摘要 |
An image pickup device is provided with a reduced profile. There is provided a circuit board that is formed with a predetermined circuit pattern having bonding portions and which has a through hole, a pickup element that has a light-receiving portion and bonded portions and which is secured to one surface of the circuit board by bonding the bonded portions to the bonding portions of the circuit pattern, and a cover body which has a lens portion for guiding incident light to the light-receiving portion of the pickup element through the through hole of the circuit board and that is secured to another surface of the circuit board opposite to the above-mentioned surface such that the through hole is covered.
|
申请公布号 |
US6518656(B1) |
申请公布日期 |
2003.02.11 |
申请号 |
US20000689753 |
申请日期 |
2000.10.13 |
申请人 |
SONY CORPORATION |
发明人 |
NAKAYAMA YOSHINORI;NAKAYOSHI HIROKAZU |
分类号 |
H01L27/14;H01L27/146;H01L31/0203;H01L31/0232;H04N5/225;H04N5/335;H05K1/02;H05K3/42;(IPC1-7):H04N5/225;G02B7/00;G09G3/32;H01L23/22;H01L23/02 |
主分类号 |
H01L27/14 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|