| 摘要 |
Methods of making packages for integrated circuit devices, and in particular for attaching a plurality of integrated circuit die to a substrate strip, are disclosed. The substrate includes a plurality of die mounting sites. A B-staged epoxy film is on each site. An exemplary method includes placing an integrated circuit die on the adhesive film of each site. After a plurality of integrated circuit die are individually placed on the substrate, the adhesive films of a plurality of sites are cured simultaneously in a batch process. The curing permanently attaches the die to the substrate. Subsequently, the die are wire bonded to their respective substrate sites and encapsulated. The encapsulated substrate is cut to form individual packages. A tool system for performing the die attachment process includes a head for picking up a die and placing the die on an adhesive film on the substrate strip, and a pair of opposing plates capable of pressing together and applying pressure and heat to a plurality of sites simultaneously so as to cure the adhesive film of the plurality of sites.
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