| 摘要 |
PROBLEM TO BE SOLVED: To provide the bonding tool of an electronic component, which suppresses the occurrence of bending vibrations in the vertical direction and prevents the damage of the quality to the electronic component. SOLUTION: In an electronic component bonding device, the bonding tool gives vibration to the electronic component while it is press-fixed to a substrate. A fitting seat 15a fixing the bonding tool 14 to a block 13, which vertically ascends and descends the substrate is arranged in a place equivalent to the crest of stranding waves of vibrations in a horn 15. The fitting seat 15a an a horn 15 body part are connected by a connection part A having a notch part B, which has a thin cross section and is vertically symmetric. Thus, bending rigidity of the cross section of the connection part A can be made small, and the transmission of bending vibration excited by the fixing part to the horn main body is suppressed. The occurrence of displacement in the vertical direction due to the bending vibration of the horn 15 can be suppressed. |
