| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated wiring board which is equipped with an interlayer conduction structure increased in connection area and reduced in number of manufacturing processes, and to provide its manufacturing method. SOLUTION: A resin plate (resin layer) 10 having interlayer conduction structure formed of vias (Ag pin) 13 and a resin plate (resin layer) 20 having an interlayer conduction structure formed of vias (Cu pin) 23 are combined. At this point, the resin plates 10 and 20 are arranged so as to locate the vias 13 and 23 at the same position. The via 23 protrudes from the resin plate 20. In this state, the resin plates 10 and 20 are pressed into one piece. By this setup, a laminated wiring board 100 having an interlayer conduction structure in which conductor layers 11 and 21 are electrically connected together through the vias 13 and 23 can be manufactured. At each joint between the vias 13 and 23 of the laminated wiring board 100, the Cu via 23 protruding from the surface of the resin plate 20 bites into the Ag via 13. |
