发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device, for which the light receiving sensitivity and frequency characteristics of a photodetector especially to the light of a short wavelength are improved, and simultaneously realizing desired performance for a semiconductor element other than the photodetector, and to provide its manufacturing method. SOLUTION: A semiconductor substrate 14 is constituted of a first conductivity-type semiconductor substrate 11 and a second conductivity-type semiconductor layer 13, and the thickness of the semiconductor layer 13 in the light receiving part of a photodiode 27 is made smaller than the thickness of the semiconductor layer 13 in a bipolar transistor 28. Thus, an element structure, such as the distance to a depletion layer near the joining boundary of the semiconductor substrate 11 and the semiconductor layer 13 from the surface of the light-receiving part of the photodiode 27 and the element structure, such as the thickness of the semiconductor layer 13 in the bipolar transistor 28, are optimized independently of each other.
申请公布号 JP2003037259(A) 申请公布日期 2003.02.07
申请号 JP20010223120 申请日期 2001.07.24
申请人 SONY CORP 发明人 FUJISAWA TOMOTAKA
分类号 H01L27/14;H01L21/8222;H01L27/06;H01L29/86;H01L31/10;(IPC1-7):H01L27/14;H01L21/822 主分类号 H01L27/14
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