| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition using an aminimide as a photo-base generator which efficiently generates a sufficiently strong base even under low light exposure in combination with a polyamic acid and to provide a method for producing a relief pattern and a method for producing a heat resistant coating. SOLUTION: The photosensitive resin composition contains (a) an aminimide compound which generates a base when irradiated with active light and (b) a polyamic acid. In the method for manufacturing a relief pattern, a coating comprising the photosensitive resin composition is patternwise irradiated with active light and heated at 50-180 deg.C and the unirradiated regions are removed by development. In the method for manufacturing a heat resistant coating, a coating comprising the photosensitive resin composition is irradiated with active light all over and heated at 80-300 deg.C. |
