| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit and an electronic apparatus using it, and a method for checking the semiconductor integrated circuit, by which failure detection performance can be improved in a state of wafer. SOLUTION: A checking electrodes K1, K2 are formed by connecting them at positions other than positions to which outside-connecting electrodes P1-P4 and grounding electrodes G1-G4 among circuit elements of the semiconductor integrated circuit 10 are connected. Particularly, the checking electrode K2 is connected to a gate of a FETQ3 through a resistance R7. Voltages are applied to the outside-connecting electrodes P2, P3 and checking electrodes K1, K2, the grounding electrode G2 is grounded, and currents passed from the outside- connecting electrodes P2, P3 are confirmed. A check for each of circuit elements of the semiconductor integrated circuit can be easily made on the basis of the amount of the current passed from the outside-connecting electrodes P2, P3, then, a yield after packaging can be improved.
|
