| 摘要 |
PROBLEM TO BE SOLVED: To load a semiconductor chip on both surfaces of a wiring board despite its being a semiconductor device package of a BGA structure, and to provide a more highly integrated stacked package. SOLUTION: A first wiring board 4 provided with a wiring pattern 2 on both surfaces, for which the wiring patterns 2 on both surfaces are conducted by a through-hole 3 or a blind via hole, and a second wiring board 10 of larger thickness than that of a semiconductor chip height provided with a through-part 9 through which the semiconductor chip 13 enters on the center part and provided with the wiring pattern 6 on both surfaces, for which the wiring patterns 6 on both surfaces are conducted by the through-hole 7 or the blind via hole, are piled up. Also, the wiring patterns 2 and 6 of the two wiring patterns are electrically conducted, and they are mechanically joined as well and the wiring board 12 is constituted, and it serves as a tape carrier for a semiconductor device. |
