| 摘要 |
PROBLEM TO BE SOLVED: To enable formation of an electrode which is optimum for wire bonding of an electronic component usable for high frequencies, such as a GHz band, by devising the structure of electrodes to be provided to a board for mounting of the electronic component. SOLUTION: The board includes a substrate 11 for mounting an electronic component thereon and an electrode 12 provided on the substrate 11. The electrode 12 has an electrode layer 12A as a plating base layer formed, by patterning a copper foil of the substrate 11, an electrode 12B as a plating intermediate layer formed on the electrode layer 12A by plating a conductive member on the layer 12A, and an electrode layer 12C, plated so as to envelope the entirety of the base electrode layer 12A and intermediate electrode layer 12B with another conductive member. With this structure, a wiring electrode or terminal electrode of a composite electrode structure, where the base and intermediate electrode layers 12A and 12B are used as core materials and are entirely enveloped by the electrode layer 12C of the other conductive member can be provided. |
