CHIP LAMINATED-TYPE ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a chip laminated-type electronic component whose mounting properties with the land part of a printed board is satisfactory and which can easily be manufactured, and to provide the manufacturing method. SOLUTION: The laminated-type electronic part is provided with a substrate, a conductive member embedded in the substrate and an outer electrode which is arranged in the substrate and is conducted with the conductive member; and different regions are disposed at a part where the thickness of the conductive member is embedded in the substrate and a part where it is exposed to a substrate side and is brought into contact with the outer electrode.