| 摘要 |
PROBLEM TO BE SOLVED: To provide Ni-plated particles having superior electroconductivity, little cohesiveness, and uniform thickness of the Ni film. SOLUTION: The Ni-plated particle 1 having a Ni film 3 plated by an electroless Ni plating method on the surface of a particle core 2, has a less P content in the surface side 3x than in the particle core side 2, along a depth direction of the whole Ni film 3.
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