发明名称 |
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor package which can seal chips without causing a swell on each chip and without depending on potting. SOLUTION: Terminals of semiconductor chips are connected with their peripheral electrode wirings, and the semiconductor chips and their peripheral electrode wirings are covered with a laminated plastic film without using potting technology.
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申请公布号 |
JP2003037124(A) |
申请公布日期 |
2003.02.07 |
申请号 |
JP20010222558 |
申请日期 |
2001.07.24 |
申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
WATANABE MASANAO;HIRATA YASUKO |
分类号 |
H01L21/56;(IPC1-7):H01L21/56 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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