| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor laser array device provided with constitution wherein the height of a light emission point of each semiconductor element constituting the device becomes equal with respect to a bonding surface of a submount. SOLUTION: The semiconductor laser array device 50 is provided with a semiconductor laser array main body 16 which is bonded to the submount 18 via a solder layer 22, and has the same constitution as the conventional semiconductor laser array device 10, except that spacer balls 52 are dispersedly arranged in the solder layer. At least three spacer balls made of SiO2 or Al2 O3 which have a melting point higher than that of solder and a diameter equal to a prescribed thickness of the solder layer are dispersedly arranged in the solder layer. Each of the balls is in contact with a lower surface of the array main body and a bonding surface of the submount. When the array main body is bonded to the submount, the thickness of the solder layer is regulated by the spacer balls. When the array main body is pressed against the submount, it is not caused as in the conventional device that solder in the solder layer moves and is unevenly distributed in the periphery of the bonding surface of the submount, and the array main body is deformed. |
