| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of the conventional surface-mounted LED lamp being apt to absorb ultrasonic waves and to damage an LED chip at welding of an LED chip to the base of the lamp, because the base is formed of a relatively soft printed circuit board and an excessively large ultrasonic wave output is required at the time of welding the LED chip to the base. SOLUTION: A surface-mounted LED lamp 1 consists of mounting an LED chip on a base 2, which is surface-mounted on a printed circuit board by ultrasonic welding. Since at least a portion of the lamp 1 which serves as the base 2 is formed of a ceramic member, the base 2 will not absorb ultrasonic vibrations, when the LED chip 3 is welded to the base 2 because of the hardness of the ceramic member forming the base 2, and the chip 3 can be welded with little ultrasonic wave output. |
