| 摘要 |
PROBLEM TO BE SOLVED: To improve an adhesion of a silver layer deposited from an immersion plating bath. SOLUTION: This plating method includes bringing a less electropositive metal than silver (zinc, iron, tin, nickel, lead, copper or these alloys), into contact with an azole compound (triazole, benzotriazol, tetrazole, imidazole, benzimidazole, indazole or the like), before bringing it into contact with an immersion silver plating bath. The contact of the metal with the azole compound is preferably performed in a cleaning process or an etching process after the cleaning process. Such compositions and methods are particularly useful in the manufacture of electronic devices. |
