| 摘要 |
PROBLEM TO BE SOLVED: To provide a high frequency semiconductor device which can reduce a signal transmission loss by stably reducing the piling-up amount of a die- bonding adhesive onto the side face of the semiconductor chip even in a mass production. SOLUTION: This semiconductor device comprises a high frequency circuit board 1 made of a microstrip line and a baseboard 3 for mounting the high frequency circuit board 1. The high frequency circuit board 1 is conductively bonded to the baseboard 3 with an Ag adhesive 2. The printed pattern for the Ag adhesive 2 is designed to be an intermittent figure in a substantially normal direction from the side face of the side where a high frequency transmission channel exists to connect the high frequency circuit board 1 to the external. Hereby, an overflowing Ag adhesive from the high frequency circuit board 1 is more from the side face of the side where the high frequency transmission channel does not exist than from the side face of the side where the high frequency transmission channel exists. |
