| 摘要 |
PROBLEM TO BE SOLVED: To solve the problems of wire package terminals being required to be connected by a circuit wiring board or the like, which leads to a result that a mounting area becoming large and the wirings have to be crossing three- dimensionally. SOLUTION: A surface mounted package is a semiconductor package, for which two transistor chips of a first transistor chip and a second transistor chip are incorporated, an arm is constituted, by electrically connecting the emitter of the first transistor chip and the collector of the second transistor chip and a terminal electrically connecting the collector and base of the first transistor chip to the outside of the package and the terminal electrically connecting the emitter and base of the second transistor chip to the outside of the package are provided, and incorporates a semiconductor chip having a plurality of the terminals or the like. An inverter arm is constituted into one package. |
