| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of a circuit device employing a ceramic substrate, a flexible sheet, or the like, as a supporting substrate for mounting circuit elements that a manufacturing method exhibiting high mass productivity is not yet established when the size and thickness of the circuit device are reduced. SOLUTION: The circuit device comprises a plurality of conductive patterns 51 at respective mounting parts isolated electrically by isolation trenches 61, a thermosetting resin layer 50A covering the surface of the conductive patterns 51 while filling the isolation trenches 61, and an insulating resin 50B bonded to the thermosetting resin layer 50A while covering a circuit element 52 wherein bonding strength is enhanced between the isolation trench 61 and the thermosetting resin layer 50A and the insulating resin 50B, and the conductive pattern can also be arranged beneath the circuit element 52. |
