| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting method of a semiconductor device and its mounting structure, where superior the electrical characteristics of a connection part can be obtained, without deforming a member by thermal expansion, and to provide a semiconductor device and its manufacturing method. SOLUTION: A capsule 19 which contains liquid such as water is mixed in a mold resin 9. A semiconductor device 3 is formed by resin-sealing on the upper surface of an intermediate substrate 10, including a semiconductor chip 4 fixed to the substrate 10, by using the mold resin 9. In the case of heating by reflow, when the semiconductor device 3 is mounted on a mother substrate 2, warpage caused by difference of coefficients of linear thermal expansion of the respective members is relaxed by bubbles 21 in the mold resin 9, so that destruction of a bonding part due to warpage can be restrained. |
