| 摘要 |
PROBLEM TO BE SOLVED: To improve the yield of and reduce the test cost of a multi-chip type semiconductor device in which chips are connected in a package by providing a fuse in a first semiconductor chip, providing no fuse in a second semiconductor chip being a rewritable memory. SOLUTION: A second semiconductor chip 2 has a redundancy cell replaced with a defective bit, a relieving state determining circuit 23 which is not connected to a first semiconductor chip and in which a redundancy relieving solution for relieving a defective bit inputted from an external input pad PD2D is stored to realize a state after redundancy relieving in which a defective bit is replaced by a redundancy cell, and a command decoding circuit 25 controlling an input to the relieving state determining circuit from the external input pad PD2D by a signal inputted from an external input pad PD2B. |
