| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that includes a fuse and has an excellent yield. SOLUTION: A fuse part 110 consisting of a plurality of fuses 20 that are melt by laser beam radiation is included in a semiconductor device. The fuse 20 is formed on a first insulating layer 36 and is arranged with a predetermined pitch. The side surface and the upper surface of the fuse 20 are covered with a second insulating layer 19. |
