| 摘要 |
PROBLEM TO BE SOLVED: To provide a reliable, resin-sealed type semiconductor device and a method for manufacturing the same. SOLUTION: After the surface of an assembly comprising a supporting plate 12, lead terminals 13, a semiconductor device 14 and fine lead wires 15 is coated with a lubricating material layer 19, the assembly is sealed by the resin-sealing body 16. The lubricating material layer 19 consists of silicon oil, and it effectively absorbs transmission of thermal stress caused by thermal contraction or thermal expansion of the resin-sealing body 16 to the semiconductor device 14, etc. |
