发明名称 INTERLAYER CONNECTION STRUCTURE OF MULTILAYER WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To reduce the manufacturing cost of a multilayer wiring board by reducing man-hours required for an assembly operation. SOLUTION: Flexible printed circuits 20a and 20b are laminated in layers on the main surface of a base member 10. A connection terminal 30 is connected between the wiring leaders 23a and 23b of the flexible printed circuits 20a and 20b. A terminal housing hole 12 where the connection terminal 30 is inserted in the direction vertical to the main surface of the base member 10 is provided to the base member 10. The flexible printed circuits 20a and 20b are each equipped with a tongue which is so bent as to penetrate into the terminal housing hole 12 along its side face. The wiring leaders 23a and 23b are provided to the tongues. The tongues each provided to the layers are so shifted as to enable the wiring leaders 23a and 23b of each layer to be uncovered inside the terminal housing hole 12. The connection terminal 30 pinches the tongues together with the side wall of the terminal housing hole 12 with a prescribed spring pressure, and is equipped with an elastic connection piece 33 connected to the wiring leaders 23a and 23b of each layer.
申请公布号 JP2003037364(A) 申请公布日期 2003.02.07
申请号 JP20010221396 申请日期 2001.07.23
申请人 FUJIKURA LTD 发明人 SAKIYAMA KOJI;MOMOTA ATSUSHI
分类号 H05K1/11;H05K1/02;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K1/11
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