发明名称 |
Surface-mountable light-emitting diode structural element |
摘要 |
A surface-mountable light emitting diode structural element in which an optoelectronic chip is attached to a chip carrier part of a lead frame, is described. The lead frame has a connection part disposed at a distance from the chip carrier part, and which is electrically conductively connected with an electrical contact of the optoelectronic chip. The chip carrier part presents a number of external connections for improved conduction of heat away from the chip. The external connections project from a casing and at a distance from each other.
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申请公布号 |
US2003025170(A1) |
申请公布日期 |
2003.02.06 |
申请号 |
US20020259556 |
申请日期 |
2002.09.27 |
申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH & CO. OHG |
发明人 |
ARNDT KARLHEINZ |
分类号 |
H01L33/48;H01L33/62;H01L33/64;(IPC1-7):H01L31/020 |
主分类号 |
H01L33/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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