发明名称 |
Process for etching thin-film layers of a workpiece used to form microelectronic circuits or components |
摘要 |
A process for removing at least one thin-film layer from a surface of a workpiece pursuant to manufacturing a microelectronic interconnect or component is set forth. Generally stated, the process comprises the oxidation of at least a portion of the at least one thin-film layer and the etching of the oxidized thin-film layer using an etchant that selectively etches primarily the oxidized thin-film layer.
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申请公布号 |
US2003027430(A1) |
申请公布日期 |
2003.02.06 |
申请号 |
US20010999112 |
申请日期 |
2001.11.01 |
申请人 |
STEVENS E. HENRY;PFEIFFER RICHARD |
发明人 |
STEVENS E. HENRY;PFEIFFER RICHARD |
分类号 |
B08B3/04;C23F1/18;H01L21/00;H01L21/3213;H01L21/768;(IPC1-7):H01L21/302;H01L21/461 |
主分类号 |
B08B3/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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