发明名称 |
Systems with high density packing of micromachines |
摘要 |
Micromachine systems are provided. An embodiment of such a micromachine system includes a substrate that defines a trench. First and second microelectromechanical devices are arranged at least partially within the trench. Each of the microelectromechanical devices incorporates a first portion that is configured to move relative to the substrate. Methods also are provided.
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申请公布号 |
US2003025168(A1) |
申请公布日期 |
2003.02.06 |
申请号 |
US20010923000 |
申请日期 |
2001.08.03 |
申请人 |
HARTWELL PETER G.;WALMSLEY ROBERT G. |
发明人 |
HARTWELL PETER G.;WALMSLEY ROBERT G. |
分类号 |
B81B3/00;B81B7/00;B81B7/04;(IPC1-7):H01L31/113 |
主分类号 |
B81B3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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