| 摘要 |
<p>Semiconductor wafers (W) are contained in a cassette (CR) at a cassette station (10). A processing unit (18) includes a multi-stage process chambers (54). A wafer stack placing unit (14) for temporarily placing semiconductor wafers in a stacked state is provided between the cassette station (10) and the processing unit (18). A loader/unloader (12) transfers semiconductor wafers one by one between the cassette station (10) and a wafer stack placing unit (14). A transfer module (16) transfers semiconductor wafers supported in a stack at a time between the wafer stack placing unit (14) and the processing unit (18).</p> |
